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Internal Curing Structure of Tunnel Oven

Core Product Value

The Tunnel Oven focuses on the core scenario of Final Curing of Solder Mask Ink. With three technical advantages—Continuous Curing, Precise Temperature Control, and Explosion-Proof Design—it addresses the pain points in the midstream of PCB production: "low curing efficiency, poor uniformity of solder mask ink, and flammability/explosiveness of solvent-based ink":

Efficiency Boost via Continuous Curing: Continuous pass-through design enables automated and continuous production for the solder mask ink curing process, increasing production line efficiency by over 40%.
Precise Temperature Control & Uniformity: Accurate temperature control at 140-150℃ with ±1℃ uniformity, ensuring full curing and uniform surface of solder mask ink without bubbles or color differences.
Explosion-Proof Safety Guarantee: For solvent-based solder mask ink, it adopts explosion-proof heating system, gas monitoring, and high-power exhaust design to eliminate flammable and explosive risks.

Core Technical Features

Continuous Pass-Through Curing

Steel belt/mesh belt continuous conveying design allows PCBs to pass through the multi-zone tunnel at a constant speed. It enables automated and continuous production for the solder mask ink curing process, adapting to the rhythm of large-scale PCB production lines.

Precise Temperature Control & Uniformity

Independent PID temperature control for multi-zones + infrared temperature measurement feedback. Temperature range is 140-150℃ with ±1℃ uniformity, ensuring consistent curing degree of solder mask ink across the entire PCB surface, improving appearance and insulation performance.

Explosion-Proof Safety Design

Explosion-proof heating tubes, explosion-proof motors, and combustible gas monitoring system (optional). High-power exhaust device quickly discharges solvent vapor, meeting Ex dⅡBT4 explosion-proof requirements for solvent-based solder mask ink.

Programmable Temperature Curve

PLC control system supports 16 segments of programmable temperature curves. It can customize heating, heat preservation, and cooling processes according to the curing characteristics of different brands and types of solder mask ink, with strong adaptability.

Efficient Hot Air Circulation

Corrosion-resistant centrifugal fan + deflector design enables 360° uniform hot air circulation inside the tunnel. Curing efficiency is increased by 30% while avoiding local overheating or insufficient curing of PCBs.

Flexible Bandwidth Adaptation

Bandwidth supports customization of 300mm, 500mm, 800mm, 1200mm, and other specifications. It adapts to the curing needs of PCBs of different sizes, including single-sided, double-sided, and multi-layer boards.

Technical Parameters & Performance

Core Parameters

Applicable Process Final Curing of Solder Mask Ink

Temperature Range 140-150℃

Temperature Uniformity ±1℃

Heating Method Clean Hot Air Circulation Heating

Temperature Control Method：Multi-Zone PID + Programmable Curve

Explosion-Proof Class (Optional)：Ex dⅡBT4

Bandwidth Specifications (Optional)

? 300mm
? 500mm
? 800mm
? 1200mm
? Custom

Conveying Speed

? 0.5-5m/min (Adjustable)
? Adapts to Different Curing Time Requirements

Temperature Uniformity Test (150℃ Working Condition)

Test Conclusion

Under the typical curing temperature (150℃) for solder mask ink, the temperature fluctuation in different zones of the tunnel oven (entry, middle, exit) is ≤±1℃. This ensures consistent curing degree of solder mask ink across the entire PCB surface, meeting the appearance and performance requirements of high-end PCBs (e.g., boards for automotive electronics and medical equipment).

Application Scenarios & Processes

Core Process for Final Curing of Solder Mask Ink

After solder mask ink printing, final curing is required at 140-150℃ to form a dense, insulating, and wear-resistant solder mask layer. The tunnel oven ensures full cross-linking and curing of the solder mask ink while avoiding defects such as bubbles and pinholes through "continuous conveying + multi-zone temperature control + uniform hot air".

Typical Solder Mask Ink Curing Process Curve

1 Preheating Zone：Room Temp → 100℃, gradient heating in multi-zones for initial ink curing
2 Curing Zone：100℃ → 150℃, core curing zone with 20-30min heat preservation (full ink cross-linking)
3 Cooling Zone：150℃ → 60℃, slow cooling to avoid stress cracking of the solder mask layer

The equipment's programmable temperature control system can accurately replicate the above multi-zone curve. Through "gradient heating + sufficient heat preservation + slow cooling", it ensures the adhesion, insulation resistance, and chemical resistance of the solder mask layer reach optimal levels.

Extended Application Scenarios

Character Ink Curing

Final curing of character ink (e.g., silk-screen characters) on PCBs. The 140-150℃ temperature range ensures clear, wear-resistant, and chemical-resistant characters.

Coating Curing (e.g., Conformal Coating)

Curing of conformal coatings (moisture-proof, mildew-proof, salt-fog-proof) on PCB surfaces. The continuous tunnel oven enables large-scale and uniform coating curing, improving protection performance.

High-Temperature Tape Curing

Thermal curing and bonding of special high-temperature tapes. The continuous high-temperature environment of the tunnel oven ensures full adhesion between the tape and PCB, enhancing reliability.

Successful Application Cases

PCB

Continuous Drying Solution for Precision PCB Manufacturers

1. Core Equipment Configuration and Technical ParametersEquipment TypeQuantityKey Technical ParametersApplication ScenariosPrecision Tunnel-Type Continuous Drying Line3 linesTemperature Control Range: 50~200℃ (Accuracy ±0.3℃); Conveying Speed: 0.2~1.5m/min (frequency-variable adjustable); Drying

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PCB

PCB Material Curing Solution

1. Core Equipment Configuration and Technical ParametersEquipment TypeQuantityKey Technical ParametersApplication ScenariosMulti-layer Board Lamination & Curing Machine4 unitsTemperature Control Range: Room Temperature ~ 220℃ (Accuracy ±0.5℃); Lamination Pressure: 0.5~5MPa (Adjustable); Heati